Mainland China chipmaking capacity set to outpace Taiwan by 2030

Mainland China chipmaking capacity is accelerating, now poised to become the world’s leading semiconductor foundry hub by 2030, and overtaking Taiwan in total capacity, according to the latest projections from Yole Group. Chinese dominance in this field is fueled by the country’s push to manufacture its own tech as U.S. export restrictions continue to ramp up. China’s rapid rise in semiconductor manufacturing Yole Group forecasts that China’s share of global foundry capacity will rise to 30% by 2030, up from 21% in 2024. In contrast, Taiwan, the current leader, held a 23% share last year. China’s foundry expansion has already...